BGA CHIP REPAIR TECHNICIAN COURSE FOR BEGINNERS IN SURREY BC AND ONSITE

Ball Grid Array, or BGA, is a packaging type that manufacturers use to mount devices such as microprocessors with many hundreds of pins. Manufacturers mount BGA packages of integrated circuits onto the BGA board directly before soldering them in place. This mounting and soldering process is called BGA. A BGA package has two boards: the chip package and the ball grid array. The ball grid array holds the balls in place, whereas the chip package houses the BGA’s electronic circuitry, commonly called the front plane.

BGA Application

The BGA assembling technique has many applications in modern industries. These applications include;

In integrated circuits for devices such as computers, mobile phones, televisions, and other electronics

·        Military airborne applications

·        Flat and dual in-line systems

·        Automotive Industries

·        Consumer electronics

About this course.

Length: 3 days (8 hours per day total 24 hours)

Fee: Public course fee is $1450 per attendee however this course can be taken as a private course.

Main Topics: BGA Chip repair and re-balling, soldering.

Tools and materials: all included in the fee and provided in the class especially BGA PCB boards.

Equipment use: all equipment provided in the class.

location: On-site and in Surrey, BC